HiSilicon cuts costs with Arteris interconnect fabric IP
HiSilicon Technologies has licensed Arteris FlexNoC interconnect IP for use as the on-chip interconnect fabric in multiple systems-on-chip (SoCs) targeting many market segments.
Arteris is the inventor of silicon-proven commercial network-on-chip (NoC) interconnect IP solutions.
HiSilicon first adopted Arteris FlexNoC IP in 2013. Since that time, FlexNoC IP has helped enable several important HiSilicon SoCs. The ease of use and quickly-realised cost benefits resulted in fast proliferation of the FlexNoC technology for numerous SoC designs.
"Arteris is honoured that our FlexNoC IP has helped shorten design turn-around times at HiSilicon, while also shrinking chip area and cutting costs," says K. Charles Janac, President and CEO of Arteris. "HiSilicon's decision to use Arteris FlexNoC fabric IP for many projects proves that FlexNoC IP significantly reduces the economic costs and risks for companies designing SoCs."
HiSilicon Technologies Co., Ltd. is a chipset solution provider for telecom network, wireless terminal and digital media. HiSilicon provides end-to-end chipsets and solutions from telecom network to consumer electronics.