Ushio tools meet challenges in major packaging applications
The firm will showcase its solutions, including a 300mm interposer stepper, at SEMICON West 2014 at booth #2105. The exhibit will go under the slogan "Next-Generation Packaging Solutions"
Ushio has announced that it will exhibit a series of its lithography tools for advanced packaging applications.
These will include the UX7-3Di LIS 350 stepper for 3D/2.5D silicon interposers, through a panel display as well as proposed solutions for the challenges of next-generation packaging applications. SEMICON West 2014 is being held on July 8th through July 10th at the Moscone Centre in San Francisco, California.
Today, 3D packaging applications that use through-silicon via (TSV) and 2.5D/2.1D packaging applications have been spotlighted as the emerging technologies for higher integration of semiconductor devices. Maintaining an optimum balance between technologies and cost for volume production has become one of major challenges for these next-generation packaging applications.
In order to provide the best solution for this challenge, Ushio's UX7-3Di LIS 350 stepper for 3D/2.5D silicon interposers achieves significant cost reduction with its performance including single-shot exposure of large substrate areas, high throughput, and high resolution of 2 µm L/S (Line and Space).
In addition, Ushio will exhibit the Square 70 panel stepper for organic and glass interposers for further enhancement of productivity with a large shot size of 78 mm x 68 mm; the Align 600 maskless scanner for fan-out WLP enabling alignment at 600 points to achieve high yield; and the UX4 series full-field projection aligners for LED, MEMS device, and power device applications.
In addition to these lithography tools, Ushio is introducing its next-generation packaging solution that leverages a large-field precision projection lens (currently under development) which can produce a super-high resolution of 1 µm L/S.
"The next-generation packaging technologies have been spotlighted as the demand for smartphones and tablet PCs has been skyrocketing. To meet such demanding needs, we have leased and installed a projection aligner dedicated to developing 2.5D glass interposers at the Georgia Tech 3D Systems Packaging Research Centre (GT-PRC) in Georgia Institute of Technology by dispatching an engineer. We have aimed at achieving large-area patterning with the target resolution of 1 through 5 µm L/S, and will show some good results at SEMICON West 2014," comments Masayuki Itaba, General Manager of the Exposure Business Unit, Ushio Inc.
