+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

SEMICON West: memsstar Launches Next-Generation MEMS Equipment

News

memsstar Limited, a provider of etch and deposition equipment and technology solutions to manufacturers of semiconductors and micro-electrical mechanical systems (MEMS), has launched its ORBIS platform of etch and deposition process tools for MEMS manufacturing. ORBIS systems deliver the industry's most advanced single-wafer process capability, required to meet the uniformity and repeatability requirements for advanced MEMS manufacturing.

"Adoption of MEMS technology is increasing rapidly, with the explosion of mobile devices, the 'Internet of Things' and the trillion sensors roadmap," said Tony McKie, CEO of memsstar. "With such diversity in applications and increasing performance and capability, manufacturers are clearly demanding process advances, as smaller, high-functionality MEMS devices can no longer tolerate process variations that impact performance. Our new ORBIS platforms build on our first-generation systems to deliver significant process and hardware enhancements that advance manufacturing capability and performance in the MEMS industry."

The ORBIS platform enhances memsstar's production-proven and unique processing technology, which has seen strong market acceptance and has become an enabling technology for next-generation MEMS manufacturing. On the process side, enhancements built into the ORBIS platform include fully integrated process monitoring and endpoint control, as well as a new high-selectivity package. At the same time, the platform's hardware has been upgraded, which results in even better uniformity and repeatability, critical to improving yield.

The new ORBIS platform consists of three models:

ORBIS ALPHA targets institutions and universities involved in MEMS research and development (R&D) with a system based on memsstar's production-proven continuous-flow processing technology to enable next-generation process development on a cost-effective platform.

ORBIS 1000 is a single-wafer vacuum loadlock system designed for commercial R&D. It uses the same processing techniques as memsstar's volume production systems, and can be easily upgraded to a production system as business conditions change. Supported process modules include XERIX oxide and silicon vapor phase etch and AURIX SAM coatings.

ORBIS 3000 is a fully automated single-wafer platform that delivers the industry's most advanced MEMS manufacturing capability in the industry for high-volume production. It also supports the XERIX etch and AURIX coatings process modules.

"We have spent a considerable time working with customers to enhance our single-wafer architecture and technology to ensure that it will meet their manufacturing requirements now and in the future. The ORBIS platform incorporates all of these advances, increasing system performance and delivering the industry's most advanced release etch and surface modification equipment to our customers," concluded McKie.

 

 

Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: