HuaTian Technologies Chooses SPTS PVD Solution for new 300mm Expansion
SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, has announced that HuaTian Technologies (Kunshan) Co., Ltd. has selected an SPTS Sigma fxP physical vapor deposition (PVD) system for their new 300mm expansion. HuaTian will use the Sigma to deposit under bump metallization (UBM) for their 300mm Flip Chip line and interconnects for their CMOS image sensor (CIS) packages.
"We have been seeing growing interest from specialist packaging houses in China wishing to strengthen their technology offerings, particularly as they look to bring cost-efficient 300mm capabilities on line," stated Chris Jones, PVD marketing manager at SPTS Technologies. "Bumping is a cost-sensitive market, so customers appreciate the productivity advantages of our PVD systems. For instance, we degas organic passivation layers at low temperatures without compromising system throughput "“ unlike competing systems whose long degas times result in fewer wafers per hour."
The SPTS 300mm PVD system for bumping applications comprises wafer degas, pre-clean and PVD modules for depositing UBM layers in a Flip Chip process sequence. Cost of ownership savings of more than 30% are achieved thanks to a unique approach to wafer degassing, a high rate pre-clean, and long life targets and chamber furniture. The same PVD modules can also be used to deposit Ti-Cu or Al alloy interconnects for redistribution layers (RDL) in CIS wafer level packaging.
Jones added, "HuaTian is an important and progressive customer who is positioning themselves for growth within the ramping Chinese market. Their selection of our Sigma system is testament to our technical leadership and the quality of results we've achieved over competing systems. We look forward to working closer with HuaTian and supporting their success as they continue to expand their 300mm offerings."
