+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

Australian researchers pioneer graphene process using epitaxial SiC

Technique scalable to 300mm wafers

Researchers at Griffith University in Australia are successfully fabricating graphene from silicon carbide on silicon wafers using a process they say is scalable to 300mm mass production wafers.

Dr Francesca Iacopi's team are using the Australian National Fabrication Facility's (ANFF) Silicon Carbide Epitaxial reactor located at the Queensland Micro and Nanotechnology Centre at Griffith. They have combined the production of low cost silicon carbide wafers (made through the deposition of a high quality SiC layer onto low cost Si wafers), with the ability to pattern and etch this material using a plasma and finally to use novel low-temperature technology to synthesise graphene on only the required pattern.

The researchers say that the combination of a crystalline SiC core with a surface graphene coating is ideal for sensing devices. The exceptional mechanical properties of SiC (which is the second hardest material after diamonds) can be further enhanced by graphene, resulting in excellent fracture strength. Additionally, graphene offers a wealth of surface chemistry approaches for targeting specific ions and molecules. 

Earlier this year, the team produced SiC micro-resonators by replacing the traditional metals with a one molecule thick, transparent, highly conductive graphene layer. This work was detailed in a paper called 'Microresonators with Q-factors over a million from highly stressed epitaxial silicon carbide on silicon' by A.R Kermany et al in Applied Physics Letters 104, 081901 (2014).

Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: