+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

CiS Research Institute go with with Oxford Instruments


The CiS Research Institute for Microsensor Systems and Photovoltaics GmbH, Germany, has recently placed an order with Oxford Instruments for a PlasmaPro100 Estrelas etch system for research & development of MEMS components.

The PlasmaPro100 Estrelas with Brooks wafer handler offers highest process performance with industry leading throughput, while maintaining excellent ease of use. Oxford Instruments system was chosen for the excellent results obtained on vertical and tapered TSV and cantilever etching together with the high level customer support offered.

Dr. Thomas Ortlepp, Director R&D and Technology at CiS commented, "We chose the Oxford InstrumentsPlasmaPro 100 Estrelas system for a number of reasons. Very low tilt together with excellent uniformity, profile control and the possibility to work with very low power processes for precise and controlled landing etches, made this the tool of our choice. Additionally, the ease of use that enables fast turnaround in process development convinced us that this is the right tool for our research institute."

"The proven performance and versatility of the Oxford Instruments PlasmaPro 100 Estrelas made it the "˜system of choice' for CiS, says Dr. David Haynes, Sales, Service and Marketing Director, Oxford Instruments Plasma Technology. He continued: "Due to a simple widespread source and chamber-design the time to process is short. Additionally the possibility of reducing coil-power down to very low values enables processes with highest accuracy needed for innovative sensor developments."

Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: