+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

No Nonsense Simultaneous Thermal Analysis

News

NETZSCH Group has announced a new tool for thermal analysis.

Designed in the well-established vertical instrument configuration, the new NETZSCH STA 449F5Jupiter provides ultimate ease of use. The instrument has been optimized to offer a broad variety of measurement tasks.

Many applications in the fields of ceramics, metals and composites require a temperature range up to 1600°C as well as a sensitive sensor for detecting small-scale effects. The STA 449F5Jupiter, newly introduced to the NETZSCH product range alongside the modular STA instruments of the F1 and F3 series, meets these demands. Two instrument versions (with and without automatic sample changer), each including a TGA-DSC sensor, are available. In lieu of the TGA-DSC sensor, a pure TGA or a TGA-DTA can optionally be employed.

The core of the instrument is a top-loading highly sensitive low-drift micro-balance. The top-loading design, in combination with a rotating motorized furnace hoist, allows for the sample "“and, if necessary, the sensor "“to be changed easily and safely. In order to implement measurement routines quickly, the TGA-BeFlat"“a novel development for the F5 system "“avoids carrying out baseline corrections.

The STA 449 F5 Jupiter additionally comes standard-equipped with both AutoVac for automatic evacuation and refilling of the measurement system and mass flow  controllers (MFCs) for precise control over purge and protective gases. This allows for the simultaneous determination of caloric effects and mass changes under both oxidizing and inert atmospheres.

Its many years of experience in the field of simultaneous thermal analysis have made NETZSCH Gerätebau to a market leader providing guaranteed reliability in their measuring instruments and comprehensive support.

Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: