+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

Edwards Presents the Future of Sub-Fab Technology to Grenoble


Edwards Limited will offer presentations on emerging sub-fab technologies at SEMICON Europa, taking place 7-9 October 2014, in Grenoble, France.

Edwards' Mike Czerniak, Product Marketing Manager for Exhaust Gas Management, will present a paper titled, "450mm Innovations and Synergies for Smaller Diameters," that will review the implications of new processes for exhaust gas treatment and the options for managing these challenges.

Steve Cottle, Senior Product Manager for Edwards' Integrated Systems, will present at the Tech Arena on "Integrated Sub-fab Equipment Solutions "“ the Key to Manufacturing Peace of Mind." Cottle will describe how integrated sub-fab exhaust management solutions enhance process operation and reduce total cost-of-ownership in high-volume manufacturing.

"Cost-effective, high-volume manufacturing of 450mm wafers, and 10- to 7-nm devices, will introduce new materials and processes, creating new challenges for our customers. Over the many years that we have participated in the semiconductor industry, we have acquired a solid understanding of manufacturing processes and the sub-fab best practices required to support them. We leverage that knowledge every day as we work to develop innovative solutions to address the next round of challenges. These papers and presentations will provide insight to some of the newest solutions that our R&D engineers have been working on," states Ralph Loske, Edwards' European Sales Director.

 

Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: