+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

A Sensor for difficult packaging materials

News

The new SICK W2S family delivers powerful sub-miniature photoelectric positioning sensing for today's most difficult packaging materials "“ even matt black. The slim housing allows convenient mounting within tight spaces demanded by compact machinery.

The sensor's photoelectric sensing promises production efficiency and reliability even with challenging objects to detect in electronics and solar panel assembly applications.

"The new W2S performance enables high speed conveying lines to deliver efficiency even with matt black materials," says Phil Dyas SICK (UK) industrial sensor specialist. "The SICK W2S gives manufacturers the opportunity to integrate modern photoelectric sensing power where it was difficult and expensive before.

"The W2S will consistently detect matt black materials with as low as 1% reflectivity, unheard of in this size and price range.  The sophisticated background suppression software ensures high reliability and consistency whether detecting jet black, brightly-coloured, matt, transparent or highly reflective objects.

The four models in the SICK W2S sensors range are contained in a rugged IP67 rated housing that measures only 7.7 X 21.8 X 13.5 mm. The double-sealed 45o offset cable entry minimises environmental ingress and reduces accidental damage during operation.

The latest PinPoint LED offers a high-visibility light spot at sensing ranges up to three metres and can be adjusted on the unit by a three turn potentiometer. It is complemented by the high sensitivity 128 pixel array detector, ensuring unparalleled sensitivity and capability.  There is no range difference in black or white surface detection (B/W shift).

The tightly-focussed spot offers precise leading edge detection and widely visible LEDs indicate operating status. The SICK W2S is easy to set up and integrate with existing control systems.  The secure metal mounting holes and rubber bearings protect the W2S sensor from shock and vibration. The improved integrated ASIC electronics sustain safe functionality against highest EMC-level and ambient lights and the BGS sensor can be adjusted for critical backgrounds.

Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: