Dow announce new materials enabling CMP
Dow Electronic Materials has announced that key new materials in chemical mechanical planarization (CMP) and printed circuit board (PCB) layout are successfully enabling the manufacture of next-generation electronic devices. Dow's IKONIC CMP Polishing Pad series has secured global adoptions in both memory and logic at major customers with multiple fabs for 16 nm / 14nm semiconductor manufacturing. Addressing PCB layouts, Dow's CIRCUPOSIT 6000 Electroless Copper process will launch in early 2015, delivering a high-reliability solution for high-density interconnect (HDI) circuit boards.
The next generation of semiconductor chips will be manufactured at the 16 nm /14 nm nodes, with the ramp-up to high-volume manufacturing starting early next year. The IKONIC Polishing Pad series is meeting the technology requirements for these nodes, while also delivering increased pad lifetime and reduced cost of ownership. Dow supports its global customer base by manufacturing and supplying IKONIC Polishing Pads from its Taiwan and U.S. facilities.
"Dow is continuously innovating the IKONIC platform to address emerging requirements and new applications," said Mario Stanghellini, global business director at Dow Electronic Materials. "Today, the IKONIC platform is in production or qualification at top semiconductor companies in the world."
Smartphones and tablets, especially the high-end models, are the primary drivers for the ever-increasing circuit density of today's PCB designs, which require every layer interconnect (ELIC) structures. Dow is a market leader in the metallization process, which is critical to maximizing yield and performance for these devices.
"Dow's new CIRCUPOSIT 6000 Electroless Copper Process will offer enhanced microvia reliability and improved performance to meet customers' requirements for future HDI PCB products," said JR Chen, global business director at Dow Electronic Materials. "Our expertise in metallization allows us to deliver a more sustainable process, reduce treatment costs, and enable a more stable process while helping to decrease cost of ownership for our customers."
Dow's technologies are focused on meeting current and future requirements in electronic materials to address emerging trends. The Company works closely with its customers to understand their product roadmaps, thereby ensuring ability to meet the performance demands of the next generation of electronic devices.
