+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

Evatec acquires Oerlikon's Advanced Technologies business


Evatec, a thin film deposition company based in Flums, Switzerland, has  today signed an agreement to acquire the Advanced Technologies business division of the Swiss company Oerlikon to expand its existing thin film deposition systems business. The transaction is expected to close during the first quarter of 2015.

Oerlikon's Advanced Technologies division offers thin film deposition systems and processes to the semiconductor, optical data storage and advanced nanotechnology markets. Applications for the semiconductor market include LEDs, power devices, read/write heads for hard disks, Micro-Electro-Mechanical Systems (MEMS), and advanced packaging. Solutions in the advanced nanotechnology sector comprise photovoltaics, touch panels and thermoelectrics.

According to Evatec both capital equipment businesses are well positioned in their respective markets by delivering complete thin film production solutions and services to their customers around the globe.

The acquisition brings an enhanced technology portfolio and opens up possibilities to exploit synergies in technology and process know how for access to new markets and overall business growth going forward.


Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: