Kulicke & Soffa Launches Quantis QFN Capillary
Kulicke and Soffa Industries has announced the launch of the Quantis QFN Capillary, a copper wire bonding capillary based on the Company's latest and most advanced ceramics composite platform, for improved wear resistance, extended life span and superior bonding quality.
The Quantis QFN Capillary combines the extensive K&S copper applications experience with the innovatively engineered geometrical designs produced to handle the toughest process challenges on a variety of QFN carriers. Features include excellent bond quality control, process portability and response consistency, and improved cost of ownership (CoO). High precision ceramics manufacturing, advanced quality management practices, and advanced wire bonding knowledge, all together enable K&S to offer Quantis products with higher resistance to common life limiting factors in copper wire bonding.
Chan Pin Chong, Kulicke & Soffa's Vice President of the Wedge Bonder, Capillaries and Blades Business Lines, remarked, "The Quantis QFN offers lower cost of ownership due to its highly stable bond quality and consistent usable life. It is now used in production at a leading packaging manufacturer and we expect continued success."
The Quantis Family will serve the modern advanced copper wire bonding processes, offering superior precision, improved stability and CoO. The Quantis QFN is the first in this family of copper wire bonding products to be launched.
