AIT Develops Ultra-Thin DAF Adhesive for Ultra-Thin Memory Stacked Chip Devices
AI Technology, Inc. (AIT) pioneered the first self-supporting Die-Attach Film (DAF) adhesive for advanced stacked-chip memory packages over 20 years ago. AIT is again revolutionizing wafer level semiconductor packaging by offering Ultra-Thin versions (3-5 microns) of its ESP7660-HKDAF.
Using DAF at the wafer-level has become increasingly prevalent in die-attach for memory modules. However, continued success in wafer thinning technologies demands correspondingly thinner DAF, stacking as many as 20-50 chips for advanced performance in mobile devices. AIT's new Ultra-Thin DAF, (available in thicknesses of 3-5 microns) meets and solves this challenging technical demand for thinner DAF in wafer level semiconductor packaging.
The Ultra-Thin DAF is built on the same self-supporting Die-Attach Film (DAF) adhesive technology AIT pioneered in the early "˜90's. AIT now produces ESP7660-HK-DAF in Ultra-Thin 3, 5, and also 10 micron thicknesses for various processing and product requirements in large scale manufacturing. AIT produces this novel 3-5 micron thick insulating DAF in wafer-shape die-cut format as well as in pre-laminated on dicing tape (DDAF) format, both available in rolls up to 450mm in width and 100 meters in length. All production is performed in AIT's clean room manufacturing environment, located on the company's 16 acre manufacturing facilities in Princeton Junction, NJ.
In addition to being the industry's first available 3-5 micron thick Die-Attach Film (DAF), ESP7660-HKDAF maintains a high glass transition temperature of 175°C , allowing faster wire bonding at temperatures as high as 250°C. In fact, ESP7660-HK-DAF achieves one of the highest glass transition temperatures in DAF for ease of wire-bonding and molding. However, flexibility is incorporated in the material's molecularly-engineered structure for stress absorption in larger memory devices and proven reliability in thermal cycling and shock testing that is uncommon even for traditional paste die-attach adhesives. AIT's ESP7660-HK-DAF also absorbs minimal water and maintains its bond strength after extended exposure to 85%RH/85°C
