Ziptronix Licenses DBI Hybrid Bonding Patents to Sony
Ziptronix Inc.,a developer and provider of patented, low-temperature direct bonding technology for 3D integration, has announced a patent licensing agreement with Sony Corporation for application in advanced image sensors.
The agreement marks the continued adoption of Ziptronix's hybrid bonding patents for high volume applications. "This license agreement with Sony is an exciting milestone for Ziptronix because it removes any doubt that our patented DBI hybrid bonding technology is both manufacturable and beneficial for high volume applications," noted Dan Donabedian,CEO and president of Ziptronix. "We believe it demonstrates that our patented hybrid bonding technology is both enabling and cost effective as compared to stacking with TSVs.
Sony licensed Ziptronix's ZiBond direct bonding patents in 2011, which we also believe grew their image sensor market share from a few percent to the largest market share in the industry.
We expect this new license for Ziptronix's DBI hybrid bonding patents will further contribute to Sony's growth within the industry.
Any company wishing to compete in this space will need Ziptronix's DBI hybrid bonding patents.