SET celebrates 40 years
SET, a French flip-chip bonder manufacturer, is celebrating its 40th anniversary this year.
Since 1975, several hundreds of flip-chip bonders have been delivered in more than 30 countries to top-leaders companies as well as research centres for numerous applications such as pixelized sensors, radio-frequency, opto-electronics and photonics, 2 and 3D stacking, memories and ICs, lasers, LEDs and many more.
Thanks to a complete portfolio of flip-chip bonders (FCB), SET covers a full range: from the brand new ACCμRA100 (table-top, high accuracy FCB) to the high force bonding machine FC300, through FC150 medium force and automated bonder. SET is able to fit with customers' expectations on nano-imprinting too.
During these 40 years, SET has established state-of-the-art in flip-chip bonders with sub-micron post-bond accuracy, low to high force bonding and several others innovations thanks to a very close collaboration with its customers.