+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

ClassOne Enters ECD Lab Partnership with Shanghai Sinyang

News

New Applications Lab Will Be First of Its Kind in China

Semiconductor equipment manufacturer ClassOne Technology announced today that it has signed a joint electrochemical deposition (ECD) applications lab agreement with Shanghai Sinyang Semiconductor Materials Co., Ltd.  Sinyang, China's premier supplier of ECD chemicals, is purchasing ClassOne electroplating equipment and will be providing a site for demonstrating ClassOne's tools in the Chinese marketplace. SPM International Ltd., ClassOne's representative in China will also be providing product support and process assistance.

"This collaborative lab will be the first of its kind in the region," said Byron Exarcos, President of ClassOne Technology. "Now, in a single location, users will be able to see the advanced performance of ClassOne's electroplating tools and Sinyang's electroplating chemicals and also be able to evaluate processes. It allows us to provide a complete solution "” and a significant convenience "” to users throughout the region."

"We are looking forward to working with customers on the Solstice™ LT plating system because it is a high-performance tool and will provide an excellent real-world laboratory for ongoing enhancement of our chemicals," said Dr. Wang Su, Vice President of Sinyang. "The new working arrangement will also enable us to provide direct input to ClassOne as they develop future generations of wet processing equipment." 

Shanghai Sinyang is purchasing ClassOne's Solstice™ LT Electroplating System and Trident™ Spin Rinse Dryer (SRD). The Solstice LT is a two-chamber plating development tool designed for <200mm wafers. In Sinyang's applications, one chamber will be dedicated to copper plating and the second to nickel plating, with the Trident SRD servicing both process streams. This will provide significant flexibility while substantially reducing cycle time and streamlining process development. The new equipment will be installed at the Sinyang lab facility in Shanghai, which is scheduled to begin live demonstrations in late May. The lab will be able to plate virtually all metals except gold, and it can also cross-reference with all chemicals for comparison benchmarks.

In addition to the LT development tool, ClassOne also offers the Solstice S8, an 8-chamber, fully-automated electroplating system for high-volume production needs. These tools are particularly well suited to wafer level packaging (WLP), through silicon via (TSV) and other applications that are important for MEMS, Sensors, LEDs, RF, Power and many other devices.

ClassOne Technology products have been described as "Advanced Wet Processing Tools for the Rest of Us" because they address the needs of many cost-conscious users. The company's stated aim is to provide advanced yet affordable alternatives to the large systems from the large manufacturers. ClassOne supplies a range of innovative new wet processing tools, including its Solstice Electroplating Systems, Trident Spin Rinse Dryers and Trident Spray Solvent Tools (SSTs).

Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: