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Ultratech Shipping Superfast 4G To Major Memory Manufacturer In Asia

Ultratech Receives Follow-on Order for Superfast 4G In-line Inspection System for Volume Production of Current- and Next-generation Memory Devices

Ultratech, Inc, a supplier of lithography, laser processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HB LEDs), as well as atomic layer deposition (ALD) systems, announced that a major memory manufacturer from Asia placed a follow-on order for Ultratech's Superfast high-volume inspection system.

Following the success of the Superfast 3G+ system in R&D, this customer ordered Ultratech's 4G inspection system to facilitate the yield ramp of its latest memory technology. Ultratech has shipped the Superfast 4G system in the first quarter of 2015.

Ultratech's 4G system builds on the field-tested capability of the Superfast 3G+, providing the industry's highest productivity and lowest-cost 3-D topography inspection solution compared to competing systems. With a displacement repeatability of 0.2nm 1 sigma, an edge exclusion of 1.5mm and throughput of 125 wafers-per-hour, the Superfast 4G inspection system was selected as the lithography distortion control solution. To ensure a smooth transition from the 3G+ to the 4G model for high-volume production, the two inspection systems have identical optical modules insuring excellent tool-to- tool matching.

"As leading-edge DRAM and NAND Flash memory customers transition from R&D to high-volume production, they are expected to implement shape-based, patterned wafer inspection solutions in their production lines. Our Superfast 4G system delivers the highest productivity and lowest cost-of-ownership resulting in customers, such as this major Asian manufacturer, choosing Superfast solely as their production tool of record," explained Eric Bouche, Ultratech's general manager and vice president, Inspection Systems. "We have worked closely with advanced memory manufacturers to develop shape-based applications that contribute directly to production yield. This has enabled Ultratech's Superfast inspection system to achieve a market leadership position in 3-D topography. Ultratech remains committed to providing competitive advantages to its global customer base by developing leading technology in a cost-effective solution for high-volume manufacturing. We look forward to working with this valued customer to meet its production and technology roadmaps."

Ultratech's Superfast 4G Inspection System

Building on the field-proven Superfast 3G+, Ultratech's 4G Inspection System provides the industry with a 3D topography solution for advanced lithography applications with the flexibility to measure front-side of patterned wafers anywhere in the production line. Based on patented coherent gradient sensing (CGS) technology, Ultratech's Superfast 4G inspection system for patterned wafers provides the industry's highest throughput, with the lowest cost-of-ownership (3x to 5x lower) compared to competing systems. Its direct, front-side 3D topography measurement capability is well suited for patterned wafer applications such as feed-forward overlay distortion control, 3D topography measurement for focus control, and high-stress process control. The Ultratech Superfast 4G inspection system provides leading technology to address the critical needs of its global customers in a cost-effective solution.


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