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OEM Group Receives Repeat Endeavor AT System Orders


Global semiconductor capital equipment manufacturer OEM Group announced today it has received repeat orders for its Endeavor™ AT PVD system from a major FBAR filter maker.  The new systems will join the other Endeavor AT tools already being used by the customer for high volume manufacturing of thin-film bulk acoustic resonator filters, which are an essential component in wireless communication systems, for example 4G/LTE smartphones, requiring advanced high-frequency RF filters.  The Endeavor AT system reorders are a result of the demonstrated ability of the Endeavor AT to achieve excellent control of the deposited film stress, film thickness uniformity, and other critical piezoelectric aluminum nitride properties that are essential to high-yield FBAR manufacturing in a mass production environment.

FBAR filters, a MEMS device, have several important performance benefits over the surface acoustic wave filters they are displacing.  The advantages of FBAR over SAW include better power handling capabilities, smaller form factors in multi-band configurations, and crisper filtering performance "“ i.e. a steeper filter response, and superior out-of-band rejection.  It is for these reasons, and others, that FBAR technology has gone mainstream, generating the need for the additional manufacturing capacity these Endeavor AT reorders represent.

Valery Felmetsger, PVD Process Development Manager, OEM Group, Inc., lists these important criteria as being essential to the success of depositing piezoelectric AlN films for FBAR device fabrication: process stability, including controllable and reproducible deposition rates, and stable plasma-chemical reactions during sputtering; high repeatability of the film properties from wafer-to-wafer, run-to-run, and throughout the sputter target lifetime; and, independent control of AlN film properties such as thickness uniformity, film stress, and AlN crystal orientation.

According to Dr. Felmetsger, "OEM Group's reactive sputter deposition processes on the Endeavor AT satisfy all these criteria. Due to its unique operational performance and its ability to deposit AlN and metal electrode films with precisely controllable properties, Endeavor AT cluster tools have been widely implemented in the mass production of various electroacoustic devices. These repeat orders from a leading FBAR manufacturer confirm the success of OEM Group's technical approaches to AlN PVD optimization, and exemplify the value customers receive as a result of OEM Group's deep expertise in piezoelectric AlN deposition."

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