Plasma-Therm Acquires Plasma Processing Technology from Nanoplas France
Plasma-Therm has announced that it has acquired an innovative High Density Radical Flux plasma technology, which enables low temperature Bosch polymer removal.
High Density Radical Flux "” HDRF "” was developed by Nanoplas France as a superior plasma process for low-temperature removal of photoresists and organic polymer residues. These capabilities are especially important for device fabrication steps in the MEMS, LED, and advanced packaging markets.
Plasma-Therm is integrating HDRF technology into its existing suite of plasma etching, deposition, and wafer-dicing products. The Nanoplas-developed HDRF low-temperature photoresist stripping capability is also applicable to Bosch polymer removal after DRIE processing.
"We are eager to make the HDRF technology available to our existing customers and potential customers," said Ed Ostan, vice president of marketing for Plasma-Therm. "HDRF fits very well into our etch and deposition product line, because this will allow Plasma-Therm to provide multi-step solutions to specialized device manufacturers for both R&D and production use."
Plasma-Therm will also offer ongoing support to Nanoplas customers. The Nanoplas installed base is primarily made up of DSB 6000 and DSB 9000 HDRF systems. HDRF enables removal of photoresist, as well as organic polymers left on trench sidewalls following DRIE processes. These applications are sought for advanced packaging, MEMS, and power devices
