+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

The Siemens Camstar Semiconductor Suite


The Siemens Camstar Semiconductor Suite™ replaces legacy and siloed manufacturing systems that haven't kept pace with demanding and ever-changing requirements of semiconductor manufacturing. With Semiconductor Suite, manufacturers are no longer hindered by islands of automation and disjointed systems; now they can innovate, adapt and succeed. Manufacturers choosing Semiconductor Suite are up and running quickly, and are assured that the application can grow and adapt with their businesses.


Key Capabilities Include:

Manage Complex Processes - Track complex processes that include bins, rework, and lot splits with full traceability "“ even when processing requires many-to-many relationship between lots and equipment without splitting.  Run R&D in parallel with production.

Complete Traceability- All manufactured lots, wafers and serialized units are traceable by the system, spanning production across Fab, Probe, Assembly, Test and Packaging operations. Data can be collected by lot, wafer and serial number.

Integrated Equipment Maintenance - Supports proactive problem resolution and optimal equipment scheduling for both primary and sub tools.

Change Management    Quickly accommodate high volumes of manufacturing changes across multiple global sites.

Advanced Planning and Scheduling - Flexible data model and scheduling logic for unique semiconductor process and equipment models.

Statistical Process Control (SPC) - Defect data that is collected during the manufacturing process allows manufacturers to identify, analyze and solve potential problems while production continues before equipment is shut down, material is scrapped and production time is lost.

Process Automation Control - Integrates multiple pieces of equipment within the factory infrastructure into the MES, providing fully automated control, status monitoring, material tracking and data collection.

Equipment Automation - Integrates multiple pieces of equipment into the MES providing fully automated control, status monitoring, material tracking and data collection.   

Workflow Modeling - Employs drag-and-drop tools in user interfaces, making it easy to set up  dynamic routings, add new steps, vary production requirements and make customer order changes, all with revision control and an audit trail.

Dispatch Management - Shows operators the work-in-process priorities prescribed by production planners and schedulers. It eliminates guess-work by instructing the operator to work on appropriate units first. It improves manufacturing efficiency by enforcing the dispatching rules.

Operator Certification Verification - Ensures that only qualified employees perform prescribed shop floor functions.

Automatic Quality Control - Enables Automatic Future Hold and/or nonconformance report generation based on specific loss codes, SPC fail or yield limit fails. Structured data and analysis tools make it possible to solve problems quickly, which easily prevents recurrences.

Nonconformance Management - Enforces structured failure analysis, root cause identification, quarantine and final disposition, and prevents product shipment or processing beyond a prescribed step until all issues are resolved.

Label Printing - Automatically prints product labels from actual specification and manufacturing data, ensuring that labels are accurate, produced in a timely manner and are attached to the proper lot, wafer or unit.

Multiple Interface Languages "“ The ability to change your interface language preference per site.

Wafermap Visualization - Visually indicate rejects by reason and 'x/y' position.  Generate the wafer map from MES data or an existing picture.

Pilot Wafer Tracking "“ Synchronize mother lots with pilot lots to control required processing and test results.


 

Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: