News Article
Ultratech Superfast 4G+ Wins Advanced FinFET R&D Selection By Major Leading Foundry
Ultratech, Inc a supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), as well as atomic layer deposition (ALD) systems, has announced that its Superfast 4G+ was selected by a major leading foundry for the development of its 3D inspection and process control of its leading-edge FinFET processes. Ultratech's Superfast 4G+ system builds on the field leadership of the Superfast 4G, and provides the industry's highest-productivity for volume manufacturing in a low cost solution. The Superfast 4G+ system's patented coherent gradient sensing (CGS) technology enables Ultratech customers to use a single type of 3D wafer inspection tool to measure patterned wafers across the entire fab line at a low cost.
The Superfast 4G+ leads the foundry 3D process control with capabilities including:
- Improved overlay from over two years of Lithography DFF (Displacement Feed Forward) experience
- Foundry-critical, in-house, high-temperature annealing knowledge of distortion
- Rapid algorithm development enabling customization of its 3D inspection to foundry requirements
- A system architecture empowering field upgradability for multiple nodes
David Owen, Ultratech CTO for Inspection Systems, said, "It is exciting to see Superfast being selected by this leading foundry. The CGS technology is the best equipped in providing the low cost, 3D process control capabilities required by advanced foundry FinFETs. Combining 3D structures with high-temperature annealing requires the inline 3D topography and stress control in which Superfast excels. This foundry partnership and the ability to customize our algorithm to FinFET requirements led to this selection. I look forward to our FinFET process control collaboration and the development of new inspection modes."
