+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

Globalfoundries releases new process design kits

Co-design flow exploits the best of EDA design platforms to simplify RF design

Globalfoundries has announced the availability of a new set of process design kits (PDKs) with an interoperable co-design flow to help chip designers improve design efficiency and deliver differentiated RF front-end solutions in increasingly sophisticated mobile devices.

Globalfoundries ' RF Silicon-on-Insulator (RF SOI) technologies offer significant performance, integration and area advantages in front-end RF solutions for mobile devices and RF chips for high-frequency, high-bandwidth wireless infrastructure applications. Globalfoundries ' most advanced RF SOI technology, 7SW SOI, is optimised for multi-band RF switching in next-generation smartphones and poised to drive innovation in Internet of Things (IoT) applications.

 The challenges of high-frequency and large-signal design in these applications have increased the need for an interoperable co-design flow. Designed for use with Keysight Technologies'  Advanced Design System (ADS) EDA software, Globalfoundries' new 7SW SOI PDKs allow designers to edit their designs in ADS using a single Si2 OpenAccess database without any interference.

 The RFIC interoperability simplifies the design process by enabling the user to work from a single design database in ADS. This allows the user to edit and simulate schematic designs created in ADS. The same is true for layout where, for example, a user can open an IC layout cell view in ADS, instantiate the cell within a package or module, and then run an electromagnetic simulation on the complete design to validate its overall system performance.

 "After releasing the first co-design PDK for our 5PAe silicon germanium offering, we are now extending our coverage of ADS PDK to our most advanced RF SOI technology, 7SW SOI. Our 7SW platform, with superior LNA, switch devices, and trap-rich substrates, offer improved devices reception, interference rejection, and battery life for fewer dropped calls and longer talk time," said Peter Rabbeni, senior director of RF product marketing and business development at GLOBALFOUNDRIES. "Our RF SOI technology has gained significant industry traction for cellular front-end module applications, and the new RFIC interoperability feature will allow us to provide our 7SW customers additional design flexibility with a single PDK."

 "Globalfoundries customers can now access ADS' dedicated RF design flow tools based on an OpenAccess based silicon PDK," said Volker Blaschke, Silicon RFIC product marketing manager, Keysight EEsof EDA. "The new interoperability feature facilitates the design process by using a single OpenAccess design data library, removing redundant steps of keeping the design across different EDA environments in sync."

Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: