Aehr Announces Delivery of New Wafer Level Test and Burn-in System
Aehr Test Systems, supplier of semiconductor test and burn-in equipment, has announced that it has received customer acceptance for and delivered its first FOX-XP Wafer Level Test and Burn-in System. The order included multiple FOX-XP WaferPak Contactors and application development services. The delivery occurred in the third quarter of Aehr Test's fiscal 2016, which closes on February 29, 2016. Gayn Erickson, President and CEO of Aehr Test Systems, commented, "We are very excited to have delivered this first FOX-XP system and are pleased with the performance of this latest member of our FOX-P family. This system is configured for a single wafer but is scalable in our production systems for up to 25 wafers or more in parallel in a single test cell. In addition, this unique multi-wafer system uses our proprietary WaferPak wafer contactor, which is a critical portion of the solution for this particular application, due to certain specific technical requirements for testing and handling these wafers.
"This FOX-XP system and the WaferPak Contactors will be used for reliability and qualification test of sensor devices intended for a very high volume application. We believe our high power FOX-XP multi-wafer system is a perfect fit for this application and represents a significant new opportunity as this device moves into high volume manufacturing with wafer level burn-in. We believe the success of the engineering tests that are being run on this system will lead to volume production orders from this customer. This customer anticipates that they will need a significant number of systems to meet their device volume shipments beginning in the fourth quarter of this calendar year and ramp through the entire calendar years 2017 and 2018."
Aehr Test's FOX-XP system is the company's next-generation multi-wafer test solution that is capable of functional test and burn-in/cycling of flash memories, microcontrollers, sensors, and other leading-edge ICs in wafer form before they are assembled into single or multi-die stacked packages or for non-packaged die sales or applications where known good die is critical. These singulated die or single-die or stacked-die packaged parts can then be used for high reliability and quality applications such as enterprise solid state drives, automotive devices, highly valuable mobile applications, and mission critical integrated circuits and sensors. The FOX-XP system utilizes Aehr Test's FOX
WaferPak contactor, which provides a cost effective solution for making electrical contact with a full wafer or substrate in a multi-wafer environment. Aehr Test's WaferPak contactors contain up to tens of thousands of probes to contact all devices on wafers and substrates up to 300mm simultaneously.
The FOX-XP system is being developed in configurations of 25 wafers in parallel in a single cell to operate within an efficient manufacturing space footprint. Aehr Test estimates the test equipment and consumables for the emerging multi-wafer level test and burn-in market will add $200 million to $300 million to its served available market.
