Ultratech receives multiple-system order for Superfast 4G+ inspection system
Ultratech, a supplier of lithography, laser processing and inspection systems used to manufacture semiconductor devices and highbrightness LEDs (HB LEDs), as well as atomic layer deposition (ALD) systems, announced that following technical validation the company received an order for multiple Superfast 4G+ inspection systems from a leading memory manufacturer in Asia. The in-line inspection systems will be used for high-volume production of advanced 3D NAND flash memory chips. Ultratech plans to begin shipping the Superfast 4G+ systems in June.
Damon Tsai, Ultratech's Asia Director for Inspection Systems, said, "We are thrilled to have been selected for insertion in this 3D NAND flash manufacturing factory, having just finished the development of our latest generation, the Superfast 4G+. With its high throughput and improved performance, our customer recognized the yield benefits and selected the Superfast 4G+ for its latest 3D NAND flash technology ramp. This adds to the list of 3D NAND flash factories using Superfast for displacement feed-forward to the scanners. Our customer will use the system initially for bow, warpage and planarization control. This order is further proof that Ultratech's Coherent Gradient Sensing (CGS) technology provides comprehensive measurements that deliver critical wafer shape distortion and topography parameters at any point in the process flow."
