News Article
Axus introduces new PCB planarization tool
Axus Technology of Chandler, Arizona is pleased to introduce the G&P POLI-1300PCB Planarization Tool for large format substrates greater than 500 mm on a side. The POLI-1300PCB was developed to address the growing requirement for inter-layer planarization of dielectric, epoxy, and metal films on large format substrates, including fan-out boards and similar products.
The tool includes automated process controls and the large format carrier and platen needed to planarize these large substrates. The temperature-controlled platen also supports through-the-table slurry delivery, ensuring efficient delivery and slurry usage.
The POLI-1300PCB is manufactured by G&P Technology in Korea and distributed in North America by Axus Technology. Process demonstrations are available in Axus' Chandler, AZ facility.
"Where we have previously custom-configured CMP tools for large substrate applications, the G&P POLI-1300PCB is specifically designed for the application, making it a much more efficient platform," says Dr. Peter Wrschka, Axus Technology's Director of Process Technology. "The POLI-1300PCB builds on well-established methods of CMP process technology adapted to deliver improved uniformity and repeatability for these large substrates."
The tool includes automated process controls and the large format carrier and platen needed to planarize these large substrates. The temperature-controlled platen also supports through-the-table slurry delivery, ensuring efficient delivery and slurry usage.
The POLI-1300PCB is manufactured by G&P Technology in Korea and distributed in North America by Axus Technology. Process demonstrations are available in Axus' Chandler, AZ facility.
"Where we have previously custom-configured CMP tools for large substrate applications, the G&P POLI-1300PCB is specifically designed for the application, making it a much more efficient platform," says Dr. Peter Wrschka, Axus Technology's Director of Process Technology. "The POLI-1300PCB builds on well-established methods of CMP process technology adapted to deliver improved uniformity and repeatability for these large substrates."