Finetech Enhances Advanced Packaging Capabilities at Lurie Nanofabrication Facility
With a wide base of installations at many prestigious institutions and research centers, Finetech's die bonders provide unmatched solutions for advanced technology environments utilizing diverse applications. The Lambda is a semi-automated bonding platform that is ideal for product and process development of photonics devices, sensors, LED bonding, MEMs, flip chip and micro optics assembly. Bonding technologies supported by the system include thermocompression, thermosonic, ultrasonic, adhesives, curing and soldering (AuSn, C4, Indium, eutectic).
"We chose the Finetech Lambda based on the system's process flexibility, accuracy, ease of use, and reliability - important factors in an active multi-user environment," stated Pilar Herrera-Fierro, User Services Director at LNF. "The sub-micron placement capability is critical for our research being done in areas such as silicon integrated circuits, optoelectronics, MEMS, Bio-MEMS and microfluidics."
