Ultratech Announce Positive Second Quarter 2016 Results
Ultratech a supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), has announced unaudited results for the three-month period ended July 2, 2016.
For the second quarter of fiscal 2016, Ultratech reported net sales of $48.9 million as compared to $45.9 million during the second quarter of fiscal 2015.
Recent Business Highlights Include:
In June and July, Ultratech continued to supply LSA101 systems to major foundries for 28-nm and 40-nm production, with two announcements of follow-on orders.
Ultratech's proprietary LXA nanosecond melt laser annealing technology was highlighted for record achievement of enabling the world's lowest contact resistivity for FinFETs in an R&D environment.
Also in June, Ultratech announced receipt of a multiple-system, follow-on order from a leading semiconductor manufacturer for its advanced packaging AP300 lithography systems to be utilized for high-volume, fan-out wafer-level packaging (FOWLP) applications used to manufacture leading-edge chips.
Arthur W. Zafiropoulo, Chairman and Chief Executive Officer, stated, "Second quarter revenue growth was driven by strong demand for our laser spike annealing, advanced packaging, and inspection product lines. We continue to benefit from positive trends related to the extension of the 28-nm node and the expansion of fan-out packaging technologies to manufacture semiconductor chips. With order momentum and positive leverage in our model, we remain well-positioned to take advantage of the current up-cycle in our industry and anticipate strong growth in the second half of 2016."
