The Internet of Things (IoT) is now
already reality in multiple application areas. Smart sensors used in smart
cities, autonomous driving, home and building automation (HABA), industrial
applications, etc. experience challenging requirements in large interconnected
A significant increase of data transmission
and required bandwidth, leading to an overload of the communication
infrastructure can be expected.
To mitigate this, the use of artificial
intelligence (AI) in smart sensors can significantly reduce the amount of data
exchange within the networks. Philipp Jantscher from ams AG explains.
The new ERS MPDM700 supports the increasing demand for
fast prototyping and New Product Introduction of advanced packaging in
large panel format; it offers ERS´s complete range of thermal debonding
capabilities and even more powerful warpage adjustment.