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Wednesday 28th August 2019
EV Group and Schott partner to demonstrate readiness of 300 mm nanoimprint lithography
Wednesday 21st August 2019
Scalable solution for electrical fault isolation of semiconductor devices
Monday 12th August 2019
Everspin and Seagate Sign IP Patent Assignment and Licensing Agreements
Thursday 8th August 2019
Synopsys to Acquire QTronic GmbH
Thursday 8th August 2019
MagnaChip 0.35 micron 700V ultra-high voltage process technologies
Thursday 8th August 2019
Renesas battery management IC maximizes battery cell life for EV
Wednesday 7th August 2019
X-FAB brings 180nm process to french manufacturing site
Wednesday 7th August 2019
GLOBALFOUNDRIES and Arm demonstrate high-density 3D stack test chip
Wednesday 7th August 2019
Macronix Flash Memory Integrated in NVIDIA’s Next-Gen Autonomous Driving Platforms
Monday 5th August 2019
Microchip Enters Memory Infrastructure Market with Serial Memory Controller
Thursday 1st August 2019
TEL and BRIDG next gen process, tool, and device development partnership
Thursday 1st August 2019
Hitachi High-Technologies launch advanced high voltage CD-SEM
Wednesday 31st July 2019
AVX completes its largest global MLCC manufacturing facility
Monday 29th July 2019
Rambus to Acquire Northwest Logic, Extending Leadership in Interface IP
Tuesday 23rd July 2019
Edwards Joins MIT.nano as Founding Member
Friday 12th July 2019
Applied Materials Enables Emerging Memories for the IoT and Cloud Computing
Friday 12th July 2019
EU research giants to partner for next-gen innovation
Wednesday 10th July 2019
Funding for new semiconductor research centre announced
Wednesday 10th July 2019
CEA-Leti and UnitySC To Fuel Industry 4.0 with Smarter Tools
Tuesday 9th July 2019
KLA Announces New Defect Inspection and Review Portfolio
Tuesday 9th July 2019
Picosun launches a new ALD product platform for up to 200 mm wafer markets
Monday 8th July 2019
Patent Pending for LCT Active Cleaning Vacuum System
Monday 8th July 2019
EV Group earns seventh triple crown win in customer satisfaction survey
Tuesday 2nd July 2019
EU project TEMPO targets low-power chips for AI applications
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