VIDEO
EHD printhead promises semiconductor packaging revolution
Video Summary
Dr. Patrick Heissler, CEO, SCRONA AG, discusses the company’s recently unveiled 128-nozzle electrohydrodynamic (EHD) printhead, which achieves a three-digit nozzle count in digital EHD technology for the first time. Patrick describes how this major milestone offers precision, material flexibility, and scalability for semiconductor advanced packaging – including die-attach applications, dispensing ultra-small adhesive volumes with unparalleled accuracy and high-resolution printing of conductive interconnects, vital for advanced AI chiplets and chip manufacturing innovations.
