VIDEO
Streamlining the concept to production journey as advanced packaging gains momentum
Video Summary
Percy Gilbert, Senior Vice President of Engineering at Skywater Technology, discusses how the company supports customers working on novel process modules, new materials, and emerging technologies before standards or volume production exist via its Technology-as-a-Service (TaaS) model. This includes advanced sensing, heterogeneous integration, and quantum-adjacent systems. His colleague, Ross Miller, Chief Strategy Officer, shares some expert insights on advanced packaging services - specifically chiplets, 2.5/3D integration, packaged optics and quantum computing - an industry that could reach $80 billion by 2030 as chips expand beyond data centre applications.
