VIDEO
Advanced microscopy innovation meets the demands of AI and 3D packaging
Video Summary
Dr Thomas Rodgers, senior director and head of electronics marketing at ZEISS Microscopy, discusses the forthcoming International Symposium for Testing and Analysis, or ISTFA, taking place in Pasadena, California, November 16-20th. He outlines the company’s presence at the event, where the focus is on heterogeneous computing and advanced packaging – playing to ZEISS’s technical expertise and innovation strengths when it comes to advanced failure analysis solutions (both current and planned for 2026) required for this era of AI.
This video is part of a collection: SiS Magazine - 2025 Issue 9 - Part 3
