VIDEO
Tyndall with Advanced Packaging
Video Summary
In this interview, Peter O’Brien, Head of Research for Photonics Packaging and Systems Integration at Tyndall National Institute, discusses Tyndall’s role in advancing advanced packaging for photonic and semiconductor systems. He highlights key industry trends, collaboration with partners, and the challenges of scaling innovations from research to manufacturing. O’Brien also shares insights into energy-efficient system development and the breakthroughs shaping the future of advanced packaging.
