VIDEO
Imec mitigates thermal bottleneck in 3D HBM-on-GPU architectures
Video Summary
Julien Ryckaert, Vice President Logic Technologies at imec, explains how a holistic system-technology co-optimization (STCO) approach is key in reducing peak GPU and HBM temperatures under AI workloads while enhancing performance density of future GPU-based architectures. He also outlines imec’s new cross-technology co-optimization (XTCO) program in developing more thermally robust advanced compute systems and holds out the possibility of peak GPU temperatures being reduced from 140.7°C to 70.8°C under realistic AI training workloads.
