VIDEO
Thermal management key to mastering advanced packaging opportunities
Video Summary
Evelyn Weng, Product Marketing Manager at ERS electronic, provides valuable insights into the company’s expertise in providing technology solutions for some of the semiconductor industry’s key advanced packaging challenges – in particular, fan-out and panel level packaging, and warpage correction. In addition to covering ERS’s thermal management solutions, Evelyn also discusses the company’s expansion roadmap, which has seen the opening of a new production, R&D and Competence Centre in Germany and a new demonstration centre in Taiwan.
