VIDEO
Transforming semiconductor analysis
Video Summary
Trevan Landin, Senior Manager Product Marketing at Thermo Fisher Scientific, explains how the continuing evolution of advanced packaging technologies creates certain metrology challenges, for example, in terms of failure analysis, as defects are shrinking in size, are of different types and perhaps intermittent in nature. A new approach is required for failure analysis, such as Design for Test, Diagnostics and Debug (DFTDD), alongside new failure analysis test solutions. Trevan also talks us through the company’s recently launched Thermo Scientific Vulcan Automated Lab, providing a step change in atomic-scale data acquisition by integrating robotic handling with AI-enhanced instruments for semiconductor analysis.
