VIDEO
US-JOINT initiative to develop next-generation packaging technologies
Video Summary
Hidenori Abe, Resonac CTO for Semiconductor Materials, explains how US-JOINT aims to shorten the proof-of-concept (PoC) period from approximately six months to as little as one month by enabling 12 participating Japanese and U.S. companies to conduct development in Silicon Valley, home to major hyperscalers. Through collaboration between semiconductor-related companies from Japan and the United States, the initiative will accelerate global semiconductor innovation.
