VIDEO
The world’s first air-pump-on-a-chip
Video Summary
Mike Housholder, Vice President & General Manager of xMEMS' Thermal Management Business Unit at xMEMS, outlines how edge AI is creating something of a thermal crisis - as devices get thinner and more powerful, they need solid-state piezoMEMS components that deliver high performance without the bulk. So, less weight, and precise thermal management in this new generation of AI wearables and mobile devices. Mike goes on to discuss xMEMS’ µCooling solution – the world’s first air-pump-on-a-chip: a 1-mm-thin, solid-state micro-blower capable of delivering local, targeted airflow to manage heat from AI processors in devices too thin for mechanical fans – such as smart glasses, smartphones, SSDs, and other compact edge-AI systems.
