VIDEO
PIC100 platform enters high volume production
Video Summary
Sylvie Gellida, General Manager, Optical and RF Foundry Division, STMicroelectronics, discusses the implications of the company entering high-volume production of its PIC100 silicon photonics platform to support AI infrastructure demand. With plans to quadruple capacity by 2027, further expand in 2028 and with PIC100 through-silicon via (TSV) on ST’s technology roadmap, the company is delivering the benefits of higher bandwidth, lower latency, and greater energy efficiency as AI workloads surge.
