VIDEO
PIC100 platform enters high volume production
Video Summary
Sylvie Gellida, General Manager, Optical and RF Foundry Division, STMicroelectronics, discusses the implications of the company entering high-volume production of its PIC100 silicon photonics platform to support AI infrastructure demand. With plans to quadruple capacity by 2027, further expand in 2028 and with PIC100 through-silicon via (TSV) on ST’s technology roadmap, the company is delivering the benefits of higher bandwidth, lower latency, and greater energy efficiency as AI workloads surge.
This video is part of a collection: SiS Magazine - 2026 Issue 6 - Part 9
