VIDEO
High-power, high-performance semiconductor packaging design expertise
Video Summary
Dr Larry Zu, CEO of Sarcina Technology, a global semiconductor packaging specialist, discusses the launch of the company’s AI platform to enable advanced AI packaging solutions that can be tailored to meet specific customer requirements. Leveraging ASE’s FOCoS-CL (Fan-Out Chip-on-Substrate-Chip Last) assembly technology, this platform includes an interposer which supports chiplets using UCIe-A for die-to-die interconnects, allowing for the delivery of cost-effective, customizable and cutting-edge solutions. He also covers advances in Sarcina’s photonic package design capabilities for Co-Packaged Optics (CPO).
