VIDEO

Building America's first dedicated semiconductor subfab R&D facility
Video Summary

Scott Balaguer, CEO of ISRL USA, explains why International SubFAB Research Labs (ISRL USA) and AI Infrastructure Partners (AIIP) have signed a memorandum of understanding (MOU) to design, build, and operate the United States’ first purpose-built research and development facility dedicated to semiconductor subfab infrastructure - a critical step toward enabling sustainable, high-volume semiconductor manufacturing at scale. The facility will replicate high-volume manufacturing conditions using legacy and leading-edge process tools, providing members with a fully instrumented research environment - at a fraction of the $100m cost of a private pilot line - for intellectual property (IP)-protected programs covering materials reclaim, next-generation abatement, equipment validation and workforce development.