VIDEO
Multiphysics Fusion™ solutions provide integrated, system-aware co-design
Video Summary
Hany Elhak, Solutions Executive Director, Product Management at Synopsys,explains that, as chip complexity increases, physics-related challenges including signal integrity, power integrity, thermal integrity, electromagnetic effects, and co-packaged optics are becoming critical constraints at advanced nodes and in multi-die architectures, there is the pressing need for a unified EDA and multiphysics approach. The company’s Multiphysics Fusion portfolio combines Synopsys’ AI-powered EDA solutions with Ansys golden signoff analysis across timing signoff, design closure, multi-die design, and analog workflows. These solutions improve predictability and accelerate convergence for AI and high-performance computing systems.
